Evaluating the impact of scaling on temperature in FinFET-technology multicore processors

Every new technology node allows higher transistor density and more complex processors to be manufactured. Unfortunately, it also means that, for the same operating conditions, power density in the chip has to increase. However, it is not obvious how this increased power density translates into temp...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Microelectronics 2014-12, Vol.45 (12), p.1806-1813
Hauptverfasser: Zajac, P., Janicki, M., Szermer, M., Napieralski, A.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Every new technology node allows higher transistor density and more complex processors to be manufactured. Unfortunately, it also means that, for the same operating conditions, power density in the chip has to increase. However, it is not obvious how this increased power density translates into temperatures in the processor, therefore in this paper we analyze the influence of technology scaling on temperature of integrated circuit manufactured in FinFET technologies. The problem is discussed based on the results of both steady-state and transient thermal simulations obtained for two modern multi-core processors manufactured in 32nm and 22nm technologies.
ISSN:1879-2391
0026-2692
1879-2391
DOI:10.1016/j.mejo.2014.05.014