Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures

The inductively coupled plasma-enhanced atomic layer deposition (PEALD) method was used to fabricate ultrathin and smooth Pt thin films at low temperatures without the use of a Pt seed layer. The Pt thin metal films deposited at 200°C onto Si and glass substrates exhibited high conductivities (

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Thin solid films 2014-09, Vol.566, p.93-98
Hauptverfasser:	Liu, Bo-Heng, Huang, Hung Ji, Huang, Sheng-Hsin, Hsiao, Chien-Nan
Format:	Artikel
Sprache:	eng
Schlagworte:	Atomic-layer deposition Catalysis Catalysts: preparations and properties Chemistry Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Deposition Diffraction Discharges for spectral sources (including inductively coupled plasmas) Electric discharges Exact sciences and technology General and physical chemistry Glass Illumination Inductively coupled plasma Joining Materials science Methods of nanofabrication Physical properties of thin films, nonelectronic Physics Physics of gases, plasmas and electric discharges Physics of plasmas and electric discharges Platinum Silicon substrates Spinning disk reactor Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Theory of reactions, general kinetics. Catalysis. Nomenclature, chemical documentation, computer chemistry Thermal stability thermal effects Thin films
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!