Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

The results of the quantitative analysis of the microstructure of the Cu–Fe and Cu–V in-situ nanocomposite wires with diameter of 0.44–0.80mm by transmission electron microscopy are presented. Comparative fatigue tests of Cu–Fe and Cu–V in-situ nanocomposite wires and pure copper samples have been c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Composites. Part B, Engineering Engineering, 2015-03, Vol.70, p.92-98
Hauptverfasser: Nikulin, Sergey A., Rogachev, Stanislav O., Rozhnov, Andrey B., Pantsyrnyi, Viktor I., Khlebova, Natalya E., Nechaykina, Tatyana A., Khatkevich, Vladimir M., Zadorozhnyy, Mikhail Yu
Format: Artikel
Sprache:eng
Schlagworte:
A. Metal–matrix composites (MMCs)
B. Fatigue
B. Microstructures
COMPOSITES
Copper
COPPER (PURE)
CRACK GROWTH
Crack propagation
D. Fractography
FAILURE
Fatigue failure
FATIGUE PROPERTIES
Microstructure
MICROSTRUCTURES
Nanostructure
Particulate composites
Quantitative analysis
WIRE
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The results of the quantitative analysis of the microstructure of the Cu–Fe and Cu–V in-situ nanocomposite wires with diameter of 0.44–0.80mm by transmission electron microscopy are presented. Comparative fatigue tests of Cu–Fe and Cu–V in-situ nanocomposite wires and pure copper samples have been carried out using a dynamic mechanical analyzer (DMA). The in-situ nanocomposites have significantly higher characteristics of low-cycle fatigue failure resistance as compared to that of pure copper. The fatigue crack propagation areas for the nanocomposite conductors and pure copper are characterized by fatigue striations and secondary cracking.
ISSN:1359-8368
1879-1069
DOI:10.1016/j.compositesb.2014.10.046