P-92: Encapsulation Adhesive Possessing High Water Barrier and Low Corrosive Properties for Flexible Electronic Device

P-92: Encapsulation Adhesive Possessing High Water Barrier and Low Corrosive Properties for Flexible Electronic Device

An encapsulation material based on a pressure sensitive adhesive (PSA) with a high water barrier and a low corrosive properties is presented. The reproducible water vapor transmission rate is less than 5.0 g·m−2·day−1 under 40°C, 90% RH condition. A calcium reaction velocity and an electrochemical m...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2014-06, Vol.45 (1), p.1332-1335
Hauptverfasser: Naganawa, Satoshi, Nishijima, Kenta, Hagihara, Yoshiaki, Suzuki, Yuta, Nagamoto, Koichi, Kondo, Takeshi
Format: Artikel
Sprache:eng
Schlagworte:
Adhesives
Barriers
Electrodes
Electronic devices
Encapsulation
flexible electronics
Insulation
Migration
Pressure sensitive adhesives
pressure-sensitive-adhesive
water vapor permeation rate
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Beschreibung
Zusammenfassung:An encapsulation material based on a pressure sensitive adhesive (PSA) with a high water barrier and a low corrosive properties is presented. The reproducible water vapor transmission rate is less than 5.0 g·m−2·day−1 under 40°C, 90% RH condition. A calcium reaction velocity and an electrochemical migration of a copper electrode were evaluated by direct encapsulation of the test devices. This PSA possesses excellent encapsulation and electric insulation properties. It is expected as one of the most prospective materials as the direct encapsulation adhesive for the flexible electronic device.
ISSN:0097-966X
2168-0159
DOI:10.1002/j.2168-0159.2014.tb00351.x