23.4: Delamination Effect on Flexible LTPS-TFTs
A flexible TFT employing ultra‐low‐temperature process (< 400 degree‐C) was demonstrated. Two impacts after delamination were observed, including threshold voltage shift and punch‐through‐like deterioration. Scenarios regarding gate insulator quality and carrier injection was proposed and discuss...
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Veröffentlicht in: | SID International Symposium Digest of technical papers 2013-06, Vol.44 (1), p.279-282 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | A flexible TFT employing ultra‐low‐temperature process (< 400 degree‐C) was demonstrated. Two impacts after delamination were observed, including threshold voltage shift and punch‐through‐like deterioration. Scenarios regarding gate insulator quality and carrier injection was proposed and discussed. |
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ISSN: | 0097-966X 2168-0159 |
DOI: | 10.1002/j.2168-0159.2013.tb06200.x |