23.4: Delamination Effect on Flexible LTPS-TFTs

A flexible TFT employing ultra‐low‐temperature process (< 400 degree‐C) was demonstrated. Two impacts after delamination were observed, including threshold voltage shift and punch‐through‐like deterioration. Scenarios regarding gate insulator quality and carrier injection was proposed and discuss...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2013-06, Vol.44 (1), p.279-282
Hauptverfasser: Lu, Ssu-Hui, Lee, Ming-Hsien, Hsu, Yuan-Jun, Peng, Chia-Tien
Format: Artikel
Sprache:eng
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Zusammenfassung:A flexible TFT employing ultra‐low‐temperature process (< 400 degree‐C) was demonstrated. Two impacts after delamination were observed, including threshold voltage shift and punch‐through‐like deterioration. Scenarios regarding gate insulator quality and carrier injection was proposed and discussed.
ISSN:0097-966X
2168-0159
DOI:10.1002/j.2168-0159.2013.tb06200.x