Effective bond strength of pyrex thin film TE bonds for microstructure applications

Thermoelectric (TE) bonds between two silicon wafers have been formed using sputtered Pyrex films. The bond area was defined by patterning and etching reliefs into a silicon wafer. The bond geometry was varied from square to circular annuli with varying widths, diameters, and corner rounding. Bond s...

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Bibliographische Detailangaben

Hauptverfasser:	Stratton, T.G., Burns, D.W., Speldrich, B.D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Geometry Semiconductor films Shape Silicon Sputter etching Sputtering Tellurium Thermoelectricity Transistors Wafer bonding
Online-Zugang:	Volltext bestellen
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