A broadband, high isolation millimeter-wave CMOS power amplifier using a transformer and transmission line matching topology
This paper presents the design and characterization of a broadband millimeter-wave PA realized in a 130 nm standard RF-CMOS process with 8-metal-layer and transistor f T / f MAX of 117/161 GHz. The power amplifier adopts transformer and transmission line matching topology which achieves small area o...
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Veröffentlicht in: | Analog integrated circuits and signal processing 2014-11, Vol.81 (2), p.537-547 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This paper presents the design and characterization of a broadband millimeter-wave PA realized in a 130 nm standard RF-CMOS process with 8-metal-layer and transistor
f
T
/
f
MAX
of 117/161 GHz. The power amplifier adopts transformer and transmission line matching topology which achieves small area of die and wide bandwidth. A new lumped transformer model is proposed to facilitate the optimization. The measured 3 dB bandwidth is 20 GHz (from 47 to 67 GHz), the measured maximum gain is about 8.6 dB, output 1 dB compression power is 9.36 dBm and consumes 90 mA current from DC supply 1.2 V. Including GSG and DC pads, the PA occupies a compact chip area of 0.318 mm
2
, and without pads, the PA occupies 0.141 mm
2
. |
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ISSN: | 0925-1030 1573-1979 |
DOI: | 10.1007/s10470-014-0412-z |