Interface Formation of Unidirectional SiC sub(f)/SiC Composites by Electrophoretic Deposition Method

C-and BN-interphases on SiC fibers for unidirectional SiC sub(f)/SiC composites were formed by EPD process, and their microstructure and mechanical properties were investigated. Whereas the C-SiC sub(f)/SiC composites showed a pseudo-ductile fracture behavior with large amount of fiber pullout, the...

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Veröffentlicht in:Key engineering materials 2014-06, Vol.617, p.213-216
Hauptverfasser: Yoshida, Katsumi, Akimoto, Hiroyuki, Yamauchi, Akihiro, Yano, Toyohiko, Kotani, Masaki, Ogasawara, Toshio
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Sprache:eng
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Zusammenfassung:C-and BN-interphases on SiC fibers for unidirectional SiC sub(f)/SiC composites were formed by EPD process, and their microstructure and mechanical properties were investigated. Whereas the C-SiC sub(f)/SiC composites showed a pseudo-ductile fracture behavior with large amount of fiber pullout, the BN-SiC sub(f)/SiC composites fractured in a brittle manner without fiber pullout in spite of sufficient thickness of BN interphase. It is inferred from the results of EDS that sintering additives would react with h-BN-interphase, and the interphase did not act effectively for toughening the SiC sub(f)/SiC composites.
ISSN:1013-9826
DOI:10.4028/www.scientific.net/KEM.617.213