Indentation creep study on ultrafine-grained Zn processed by powder metallurgy
Ultrafine-grained Zn (UFG-Zn) with the grain size of about 200nm was processed by Spark Plasma Sintering at 300°C from fine Zn powder. The grain boundaries in the consolidated material were decorated by ZnO dispersoids with a mean thickness of ~20nm. The creep behavior was studied by indentation tes...
Gespeichert in:
Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2014-02, Vol.596, p.170-175 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Ultrafine-grained Zn (UFG-Zn) with the grain size of about 200nm was processed by Spark Plasma Sintering at 300°C from fine Zn powder. The grain boundaries in the consolidated material were decorated by ZnO dispersoids with a mean thickness of ~20nm. The creep behavior was studied by indentation tests in the homologous temperature range of 0.87–0.91. The activation energy of the creep for UFG-Zn was found to be much larger (211–252kJ/mol depending on the oxide content) than the value determined previously for coarse-grained Zn (152–159kJ/mol). The activation energy increased with increasing ZnO content in UFG-Zn. X-ray line profile analysis revealed that the population of the different dislocation slip systems changed during creep deformation, indicating a considerable dislocation activity. |
---|---|
ISSN: | 0921-5093 1873-4936 |
DOI: | 10.1016/j.msea.2013.12.050 |