Research Progress of Interface on Diamond/Copper Composites for Thermal Management

Diamond/Copper composite (Diamond/Cu) is a kind of ideal thermal management material, with high thermal conductivity and low thermal expansion. While the interface control is the center of the Diamond/Cu composites design. This paper summarizes the relevant studies on Diamond/Cu composite interface, including the researches of author’s group and other researchers. In addition, the prospect of research is mainly elaborated from following three parts: using carbide elements to control and improve the diamond/Cu composite interface bonding; the introduction of the research on Diamond/Cu composite interface with technologies of powder metallurgy, high temperature and high pressure process, spark plasma sintering and pressure infiltration; studying the thermal conductivity of Diamond/Cu composite by SThM analysis and testing technology and the Hasselman-Johnson model. The results show that controlling and improving the quality of Diamond/Cu composite interface bonding can improve the performance and stability of the composite.