Grain boundary wetting kinetics of bismuth melt into copper polycrystalline structure

Grain boundary liquid grooving process takes place during the contact of solid phase with the melt. The liquid bismuth network formation along grain boundaries (GBs) and triple junctions (TJs) was investigated in copper polycrystalline samples. The experimental observation in situ technique of Bi penetration through the Cu plate was used. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed. •The liquid bismuth network formation was investigated in polycrystalline copper.•The temperature dependencies of triple junction penetration depths were determined.•The diffusion effect on the liquid channels growth mechanism was discussed.