Thermal buckling analysis of porous circular plate with piezoelectric actuators based on first order shear deformation theory
This study presents the thermal buckling of radially solid circular plate made of porous material with piezoelectric actuator layers. Porous material properties vary through the thickness of plate with a specific function. The porous plate is assumed of the form where pores are saturated with fluid....
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Veröffentlicht in: | International journal of mechanical sciences 2014-06, Vol.83, p.57-64 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This study presents the thermal buckling of radially solid circular plate made of porous material with piezoelectric actuator layers. Porous material properties vary through the thickness of plate with a specific function. The porous plate is assumed of the form where pores are saturated with fluid. The general thermoelastic nonlinear equilibrium and linear stability equations are derived using the variational formulations to obtain the governing equations of piezoelectric porous plate. The geometrical nonlinearities are considered along with the first order shear deformation plate theory (FST). Then, closed form solution for the circular plates subjected to temperature load is obtained. Buckling temperatures are derived for solid circular plates under uniform temperature rise through the thickness for immovable clamped edge of boundary conditions. The effects of porous plate thickness, pores distribution, piezoelectric thickness, applied actuator voltage and variation of porosity on the critical temperature load are investigated. It has also been investigated the effect of different thermal expansion coefficient of porous and piezolectric plate on stability of plate.
•We analysis Thermal buckling of porous circular plate with piezoelectric actuators.•Critical temperature decreases by increasing thermal expansion coefficient of plates.•Critical temperature increases and decreases by positive and negative electric fields.•Critical temperature increases by increasing piezoelectric thickness.•Critical temperature increases by increasing porous plate thickness. |
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ISSN: | 0020-7403 1879-2162 |
DOI: | 10.1016/j.ijmecsci.2014.03.024 |