Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickelacopper contacts on silicon solar cells

For low cost high efficiency fully plated NiCu contacts on silicon solar cells, a thermal formation of nickel silicide is commonly performed for adhesion promotion. Since the results of this strategy have been found to be ambiguous, and as the interface situation is not understood, a microstructural analysis of the metalasilicon interface after thermal annealing of plated nickel layers on silicon solar cells has been carried out.