Properties of electrodeposited germanium thin films

In this paper, the results of Ge film deposited by electroplating method was studied and showed the possibility of making a NIRS sensor by the Ge film. Cu/Ti double layer structure could use the cathode electrode on the glass substrate during the GeCl4 electroplating. The deposition rate of electrop...

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Veröffentlicht in:Physica status solidi. C 2014-11, Vol.11 (11-12), p.1661-1664
Hauptverfasser: Uchida, Yasutaka, Funayama, Tomoko, Kogure, Yoshiaki, Ueno, Kazuyoshi
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Sprache:eng
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Zusammenfassung:In this paper, the results of Ge film deposited by electroplating method was studied and showed the possibility of making a NIRS sensor by the Ge film. Cu/Ti double layer structure could use the cathode electrode on the glass substrate during the GeCl4 electroplating. The deposition rate of electroplating Ge film was 100 nm/h, however, that rate was improved to 570 nm/h by introducing a spacer between Cu thin film and extraction electrode and Ar gas bubbling. The oxygen content of as‐deposited film was about 10%, however, this value reduced to lower than 1% by using the Ar bubbling. The deposited film was amorphous and its optical band gap was 0.73 eV. 200 nm‐thick Ge film was formed on flexible substrate by electroplating method. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
ISSN:1862-6351
1610-1642
DOI:10.1002/pssc.201400094