Atomic Layer Deposited Al2O3 Barrier Layers on Flexible PET Substrates

Atomic layer deposition (ALD) is utilized to grow high performance aluminum oxide (Al2O3) barrier films on flexible PET substrates, where the effects of precursor pulse time and deposition temperature on the film properties are also studied in this work. Significant differences are observed that the water vapor transmission rate of the PET substrate is largely improved by coating the Al2O3 barrier films. Further observations on the surface roughness, optical transmittance, adhesion, mechanical properties of the deposited films are also conducted. The results show that the Al2O3 film deposited with 10 msec precursor pulse time and 60°C deposition temperature behaves the best performance.