10Gb/s BOSA Employing Low-Cost TO CAN Package and Impedance Matching Circuits in Transmitter

10Gb/s BOSA Employing Low-Cost TO CAN Package and Impedance Matching Circuits in Transmitter

By using impedance (Z) matching circuits in a low-cost transistor outline (TO) CAN package for a 10Gb/s transmitter, we achieve a cost-effective and small bidirectional optical subassembly (BOSA) with excellent optical transmission waveforms and a > 40% mask margin over a wide temperature range (...

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Veröffentlicht in:IEICE transactions on electronics 2013-01, Vol.E96.C (7), p.989-995
Hauptverfasser: Asaka, Kota, Kanda, Atsushi, Ohki, Akira, Kurosaki, Takeshi, Yoshimura, Ryoko, Sanjoh, Hiroaki, Ito, Toshio, Nakamura, Makoto, Yoneyama, Mikio
Format: Artikel
Sprache:jpn
Schlagworte:
Circuits
Impedance matching
Matching
Packages
Simulation
Subassembly
Transmitters
Waveforms
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Beschreibung
Zusammenfassung:By using impedance (Z) matching circuits in a low-cost transistor outline (TO) CAN package for a 10Gb/s transmitter, we achieve a cost-effective and small bidirectional optical subassembly (BOSA) with excellent optical transmission waveforms and a > 40% mask margin over a wide temperature range (-10 to 85 degree C). We describe a design for Z matching circuits and simulation results, and discuss the advantage of the cost-effective compensation technique.
ISSN:0916-8524
1745-1353
DOI:10.1587/transele.E96.C.989