Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages

•Modal analysis was used to study thermal aging effects in electronic packages.•The set-up consisted of an electromagnetic shaker and a laser scanning vibrometer.•Thermal degradation of polymeric materials was related to modal response alteration.•Microstructural analysis and FE simulations confirmed the results.•Modal analysis can be used for non-destructive-evaluation of electronic packages. The influence of high temperature storage on the properties of epoxy based materials in microelectronic packages was investigated by application of a quantitative modal analysis technique. An electromagnetic shaker in combination with scanning laser Doppler vibrometry was used to extract the alteration of the modal response of the components in relationship with the thermal aging time. Data analysis was accomplished by the error ratio (ER) method, modal assurance criterion (MAC) and determination of an aspect ratio (AR) using an image correlation technique. Increasing the storage time resulted in a higher degree of degradation which was reflected by an increase in the values of ER, MAC and the AR. Microstructural investigations confirmed that alteration of the modal response is related to the temperature dependent gradual degradation and modification of the properties of the packaging material which was supported by finite element analysis. This present work shows the feasibility of modal analysis as an efficient and quantitative non-destructive testing method for evaluation of degradation of electronic packages.