Influence of curing temperature on properties of the polyacrylonitrile/polyimide composite films

ABSTRACT A series of polyacrylonitrile/polyimide (PAN/PI) composite films with different PAN contents are prepared under given curing temperatures (250, 300, 350, and 400°C). The microstructure of the composite films is observed by SEM, and the thermal, dielectric and mechanical properties of the co...

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Veröffentlicht in:	Journal of applied polymer science 2014-05, Vol.131 (10), p.np-n/a
Hauptverfasser:	Chen, Yaqin, Lin, Baoping, Yang, Hong, Zhang, Xueqin, Sun, Ying
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Chemical modifications Chemical reactions and properties composites Curing Dielectric properties Exact sciences and technology Materials science Mechanical properties Microstructure Networks Organic polymers Physicochemistry of polymers Polyacrylonitriles Polyimide resins polyimides Polymers Self assembly
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Zusammenfassung:	ABSTRACT A series of polyacrylonitrile/polyimide (PAN/PI) composite films with different PAN contents are prepared under given curing temperatures (250, 300, 350, and 400°C). The microstructure of the composite films is observed by SEM, and the thermal, dielectric and mechanical properties of the composite films are determined. The results show that the self‐assembly behavior of polyamic acid gives rise to connected network structure in the composite films and the variations in the microstructure of the composite films cured at different temperatures show important effects on the properties of PAN/PI composite films. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40283.
ISSN:	0021-8995 1097-4628
DOI:	10.1002/app.40283