Three dimensional thermal finite element simulation of electro-discharge diamond surface grinding

The key to achieve good surface integrity in the workpiece due to Electro-Discharge Diamond Grinding (EDDG) process, which is hybrid of grinding and EDM, is by preventing the excessive temperature and thermal stress generated during the process. EDDG in surface grinding mode called Electro-Discharge...

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Veröffentlicht in:Simulation modelling practice and theory 2013-06, Vol.35, p.97-117
Hauptverfasser: Balaji, P.S., Yadava, Vinod
Format: Artikel
Sprache:eng
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Zusammenfassung:The key to achieve good surface integrity in the workpiece due to Electro-Discharge Diamond Grinding (EDDG) process, which is hybrid of grinding and EDM, is by preventing the excessive temperature and thermal stress generated during the process. EDDG in surface grinding mode called Electro-Discharge Diamond Surface Grinding (EDDSG), used for finishing operation, is a complex machining process where several disciplines of science and engineering are involved in its theory. The complexity of the process includes the random occurrence of spark during EDM process and nonlinear behavior of workpiece material includes temperature dependent thermal properties. The present work involves the development of a simulation model to simulate the complex EDDSG process which consists of simulation of each constituent process namely EDM and surface grinding for temperature and thermal stress distribution. In order to simulate the realistic complex conditions, the three dimensional FEM is used in the process of development of the model accounting the random occurrence of the spark during EDM. The effect of different dielectric fluid, duty factor and energy partition during EDM on the temperature distribution and MRR study related to EDM contribution are reported. It is observed that the spark contributes primarily to the temperature. The predicted results can be used to determine the surface integrity of the machined surface.
ISSN:1569-190X
1878-1462
DOI:10.1016/j.simpat.2013.03.007