Creep deformation behavior of SnaZn solder alloys

Creep deformation behavior of SnaZn solder alloys

Creep properties of three SnaZn solder alloys (Sna9Zn, Sna20Zn, and Sna25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep...

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Veröffentlicht in:Journal of materials science 2014-03, Vol.49 (5), p.2127-2135
Hauptverfasser: Shrestha, Triratna, Gollapudi, Srikant, Charit, Indrajit, Murty, K
Format: Artikel
Sprache:eng
Schlagworte:
Alloys
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Zusammenfassung:Creep properties of three SnaZn solder alloys (Sna9Zn, Sna20Zn, and Sna25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50a75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-013-7905-5