Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper

► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar...

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Veröffentlicht in:International journal of fatigue 2013-05, Vol.50, p.63-71
Hauptverfasser: Goto, M., Kamil, K., Han, S.Z., Euh, K., Kim, S.S., Yokoho, Y.
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container_start_page 63
container_title International journal of fatigue
container_volume 50
creator Goto, M.
Kamil, K.
Han, S.Z.
Euh, K.
Kim, S.S.
Yokoho, Y.
description ► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN
doi_str_mv 10.1016/j.ijfatigue.2012.02.020
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1464561657</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0142112312000813</els_id><sourcerecordid>1464561657</sourcerecordid><originalsourceid>FETCH-LOGICAL-c444t-d0008863e3d2bc9a68391286f4346cf9f475a88f34055e51d48c380778a22f8c3</originalsourceid><addsrcrecordid>eNqFUMtqGzEUFaGBuEm-IdoUuhlHr5E0y2DcBxiyaddC0VzFcmZGU0l26d9Hg022hQP3Ls7j3oPQAyVrSqh8PKzDwdsSXo-wZoSyNVlArtCKatU1XLTsE1oRKlhDKeM36HPOB0JIR1S7QtPWe3Al4-jxa7Jhwgl8mGCEqeD-CLhEnOEECfA82FyCwz34mMaaGCdcUfZQlfFv2eMX2NtTiGkxy6MdBuySdW8ZV1sX5xnSHbr2dshwf5m36Pe37a_Nj2b3_P3n5mnXOCFEafp6n9aSA-_Zi-us1LyjTEsvuJDOd16o1mrtuSBtCy3thXZcE6W0ZczX_RZ9PfvOKf45Qi5mDNnBMNgJ4jEbKqRoJZWtqlR1proUc67fmzmF0aZ_hhKzNGwO5qNhszRsyAJSlV8uITY7O_hkJxfyh5wpTqUiXeU9nXlQPz4FSCa7AJODPqTavelj-G_WO_43lgo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1464561657</pqid></control><display><type>article</type><title>Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper</title><source>ScienceDirect Journals (5 years ago - present)</source><creator>Goto, M. ; Kamil, K. ; Han, S.Z. ; Euh, K. ; Kim, S.S. ; Yokoho, Y.</creator><creatorcontrib>Goto, M. ; Kamil, K. ; Han, S.Z. ; Euh, K. ; Kim, S.S. ; Yokoho, Y.</creatorcontrib><description>► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN&lt;10−6mm/c). ► A quantitative model describing the crack growth mechanism was developed based on the RPZ size. ► The changes in the CGR and morphological features of the fracture surface were successfully explained by this model. ► The CGR of small cracks growing with dl/dN&gt;10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN&lt;10−6mm/cycle. For the UFG copper, the FCGR temporarily dropped at around dl/dN=3×10−7mm/cycle and then gradually recovered with subsequent cycling. After the FCGR exceeded dl/dN=10−6mm/cycle, it was nearly proportional to the crack length. On the other hand, the FCGR of the CG copper showed no temporary drop but rather increased steadily with cycling. To understand the reason for the temporary decrease of the FCGR of UFG copper, a crack growth model based on the reversible plastic zone size at a crack tip and the related microstructural factors were developed. In addition, FCGR evaluation was discussed by applying σanl (σa, nominal stress amplitude; l, crack length; n, material constant) to both materials.</description><identifier>ISSN: 0142-1123</identifier><identifier>EISSN: 1879-3452</identifier><identifier>DOI: 10.1016/j.ijfatigue.2012.02.020</identifier><identifier>CODEN: IJFADB</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Applied sciences ; Copper ; CRACK GROWTH ; Crack propagation ; CRACKING ; CRACKS ; Cycles ; DEFORMATION ; Exact sciences and technology ; FAILURE ; Fatigue ; Fatigue (materials) ; Fatigue failure ; Grain refinement ; GRAIN SIZE AND SHAPE ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals. Metallurgy ; Plastic deformation ; PLASTIC STRAIN ; Small surface crack ; Striation</subject><ispartof>International journal of fatigue, 2013-05, Vol.50, p.63-71</ispartof><rights>2012 Elsevier Ltd</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c444t-d0008863e3d2bc9a68391286f4346cf9f475a88f34055e51d48c380778a22f8c3</citedby><cites>FETCH-LOGICAL-c444t-d0008863e3d2bc9a68391286f4346cf9f475a88f34055e51d48c380778a22f8c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.ijfatigue.2012.02.020$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>309,310,314,780,784,789,790,3550,23930,23931,25140,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=27316709$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Goto, M.</creatorcontrib><creatorcontrib>Kamil, K.</creatorcontrib><creatorcontrib>Han, S.Z.</creatorcontrib><creatorcontrib>Euh, K.</creatorcontrib><creatorcontrib>Kim, S.S.</creatorcontrib><creatorcontrib>Yokoho, Y.</creatorcontrib><title>Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper</title><title>International journal of fatigue</title><description>► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN&lt;10−6mm/c). ► A quantitative model describing the crack growth mechanism was developed based on the RPZ size. ► The changes in the CGR and morphological features of the fracture surface were successfully explained by this model. ► The CGR of small cracks growing with dl/dN&gt;10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN&lt;10−6mm/cycle. For the UFG copper, the FCGR temporarily dropped at around dl/dN=3×10−7mm/cycle and then gradually recovered with subsequent cycling. After the FCGR exceeded dl/dN=10−6mm/cycle, it was nearly proportional to the crack length. On the other hand, the FCGR of the CG copper showed no temporary drop but rather increased steadily with cycling. To understand the reason for the temporary decrease of the FCGR of UFG copper, a crack growth model based on the reversible plastic zone size at a crack tip and the related microstructural factors were developed. In addition, FCGR evaluation was discussed by applying σanl (σa, nominal stress amplitude; l, crack length; n, material constant) to both materials.</description><subject>Applied sciences</subject><subject>Copper</subject><subject>CRACK GROWTH</subject><subject>Crack propagation</subject><subject>CRACKING</subject><subject>CRACKS</subject><subject>Cycles</subject><subject>DEFORMATION</subject><subject>Exact sciences and technology</subject><subject>FAILURE</subject><subject>Fatigue</subject><subject>Fatigue (materials)</subject><subject>Fatigue failure</subject><subject>Grain refinement</subject><subject>GRAIN SIZE AND SHAPE</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals. Metallurgy</subject><subject>Plastic deformation</subject><subject>PLASTIC STRAIN</subject><subject>Small surface crack</subject><subject>Striation</subject><issn>0142-1123</issn><issn>1879-3452</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFUMtqGzEUFaGBuEm-IdoUuhlHr5E0y2DcBxiyaddC0VzFcmZGU0l26d9Hg022hQP3Ls7j3oPQAyVrSqh8PKzDwdsSXo-wZoSyNVlArtCKatU1XLTsE1oRKlhDKeM36HPOB0JIR1S7QtPWe3Al4-jxa7Jhwgl8mGCEqeD-CLhEnOEECfA82FyCwz34mMaaGCdcUfZQlfFv2eMX2NtTiGkxy6MdBuySdW8ZV1sX5xnSHbr2dshwf5m36Pe37a_Nj2b3_P3n5mnXOCFEafp6n9aSA-_Zi-us1LyjTEsvuJDOd16o1mrtuSBtCy3thXZcE6W0ZczX_RZ9PfvOKf45Qi5mDNnBMNgJ4jEbKqRoJZWtqlR1proUc67fmzmF0aZ_hhKzNGwO5qNhszRsyAJSlV8uITY7O_hkJxfyh5wpTqUiXeU9nXlQPz4FSCa7AJODPqTavelj-G_WO_43lgo</recordid><startdate>20130501</startdate><enddate>20130501</enddate><creator>Goto, M.</creator><creator>Kamil, K.</creator><creator>Han, S.Z.</creator><creator>Euh, K.</creator><creator>Kim, S.S.</creator><creator>Yokoho, Y.</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20130501</creationdate><title>Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper</title><author>Goto, M. ; Kamil, K. ; Han, S.Z. ; Euh, K. ; Kim, S.S. ; Yokoho, Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c444t-d0008863e3d2bc9a68391286f4346cf9f475a88f34055e51d48c380778a22f8c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied sciences</topic><topic>Copper</topic><topic>CRACK GROWTH</topic><topic>Crack propagation</topic><topic>CRACKING</topic><topic>CRACKS</topic><topic>Cycles</topic><topic>DEFORMATION</topic><topic>Exact sciences and technology</topic><topic>FAILURE</topic><topic>Fatigue</topic><topic>Fatigue (materials)</topic><topic>Fatigue failure</topic><topic>Grain refinement</topic><topic>GRAIN SIZE AND SHAPE</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metals. Metallurgy</topic><topic>Plastic deformation</topic><topic>PLASTIC STRAIN</topic><topic>Small surface crack</topic><topic>Striation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Goto, M.</creatorcontrib><creatorcontrib>Kamil, K.</creatorcontrib><creatorcontrib>Han, S.Z.</creatorcontrib><creatorcontrib>Euh, K.</creatorcontrib><creatorcontrib>Kim, S.S.</creatorcontrib><creatorcontrib>Yokoho, Y.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>International journal of fatigue</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Goto, M.</au><au>Kamil, K.</au><au>Han, S.Z.</au><au>Euh, K.</au><au>Kim, S.S.</au><au>Yokoho, Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper</atitle><jtitle>International journal of fatigue</jtitle><date>2013-05-01</date><risdate>2013</risdate><volume>50</volume><spage>63</spage><epage>71</epage><pages>63-71</pages><issn>0142-1123</issn><eissn>1879-3452</eissn><coden>IJFADB</coden><abstract>► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN&lt;10−6mm/c). ► A quantitative model describing the crack growth mechanism was developed based on the RPZ size. ► The changes in the CGR and morphological features of the fracture surface were successfully explained by this model. ► The CGR of small cracks growing with dl/dN&gt;10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN&lt;10−6mm/cycle. For the UFG copper, the FCGR temporarily dropped at around dl/dN=3×10−7mm/cycle and then gradually recovered with subsequent cycling. After the FCGR exceeded dl/dN=10−6mm/cycle, it was nearly proportional to the crack length. On the other hand, the FCGR of the CG copper showed no temporary drop but rather increased steadily with cycling. To understand the reason for the temporary decrease of the FCGR of UFG copper, a crack growth model based on the reversible plastic zone size at a crack tip and the related microstructural factors were developed. In addition, FCGR evaluation was discussed by applying σanl (σa, nominal stress amplitude; l, crack length; n, material constant) to both materials.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.ijfatigue.2012.02.020</doi><tpages>9</tpages></addata></record>
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source ScienceDirect Journals (5 years ago - present)
subjects Applied sciences
Copper
CRACK GROWTH
Crack propagation
CRACKING
CRACKS
Cycles
DEFORMATION
Exact sciences and technology
FAILURE
Fatigue
Fatigue (materials)
Fatigue failure
Grain refinement
GRAIN SIZE AND SHAPE
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Plastic deformation
PLASTIC STRAIN
Small surface crack
Striation
title Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T05%3A11%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effects%20of%20grain%20refinement%20due%20to%20severe%20plastic%20deformation%20on%20the%20growth%20behavior%20of%20small%20cracks%20in%20copper&rft.jtitle=International%20journal%20of%20fatigue&rft.au=Goto,%20M.&rft.date=2013-05-01&rft.volume=50&rft.spage=63&rft.epage=71&rft.pages=63-71&rft.issn=0142-1123&rft.eissn=1879-3452&rft.coden=IJFADB&rft_id=info:doi/10.1016/j.ijfatigue.2012.02.020&rft_dat=%3Cproquest_cross%3E1464561657%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1464561657&rft_id=info:pmid/&rft_els_id=S0142112312000813&rfr_iscdi=true