Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper
► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar...
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Veröffentlicht in: | International journal of fatigue 2013-05, Vol.50, p.63-71 |
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Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | ► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG).
To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN |
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ISSN: | 0142-1123 1879-3452 |
DOI: | 10.1016/j.ijfatigue.2012.02.020 |