Effects of grain refinement due to severe plastic deformation on the growth behavior of small cracks in copper

► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar...

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Veröffentlicht in:International journal of fatigue 2013-05, Vol.50, p.63-71
Hauptverfasser: Goto, M., Kamil, K., Han, S.Z., Euh, K., Kim, S.S., Yokoho, Y.
Format: Artikel
Sprache:eng
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Zusammenfassung:► The difference in the growth behavior tendency between CG and UFG copper occurred at an extremely low CGR (dl/dN10−6mm/c could be estimated by σanl, (n=7.5 for CG, n=4.4 for UFG). To clarify the effects of grain refinement on the growth behavior of small surface cracks, fatigue tests on round bar specimens were conducted on coarse-grained (CG) copper and ultrafine-grained (UFG) copper processed with equal channel angular pressing. The growth behavior of a small crack was monitored using a plastic replication technique. The difference in the growth behavior tendency between the CG and UFG copper occurred at an extremely low fatigue crack growth rate (FCGR) of dl/dN
ISSN:0142-1123
1879-3452
DOI:10.1016/j.ijfatigue.2012.02.020