Effect of a DPSS laser on the shear bond strength of ceramic brackets with different base designs
This study evaluated the shear bond strength (SBS) and adhesive remnant index (ARI) of ceramic brackets with different base designs using a 473-nm diode-pumped solid-state (DPSS) laser to test its usefulness as a light source. A total of 180 caries-free human premolars were divided into four groups...
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Veröffentlicht in: | Lasers in medical science 2013-11, Vol.28 (6), p.1461-1466 |
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Sprache: | eng |
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Zusammenfassung: | This study evaluated the shear bond strength (SBS) and adhesive remnant index (ARI) of ceramic brackets with different base designs using a 473-nm diode-pumped solid-state (DPSS) laser to test its usefulness as a light source. A total of 180 caries-free human premolars were divided into four groups according to the base designs: microcrystalline, crystalline particle (CP), dovetail, and mesh. For each base design, teeth were divided into three different subgroups for light curing using three different light-curing units (LCUs) (quartz–tungsten–halogen unit, light-emitting diode unit, and a DPSS laser of 473 nm). Applied light intensities for the DPSS laser and the other LCUs were approximately 630 and 900 mW/cm
2
, respectively. Stainless steel brackets with a mesh design served as controls. The failure modes of debonded brackets were scored using ARI. As a result, brackets bonded using the DPSS laser had the highest SBS values (16.5–27.3 MPa) among the LCUs regardless of base design. Regarding base designs, the CP groups showed the highest SBS values (22.9–27.3 MPa) regardless of LCU. Furthermore, stainless steel brackets with a mesh design had the lowest SBS values regardless of LCU. In many cases, brackets bonded using the DPSS laser had higher ARI scores and had more adhesive on their bases than on tooth surfaces. The study shows that the 473-nm DPSS laser has considerable potential for bonding ceramic brackets at lower light intensities than the other light-curing units examined. |
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ISSN: | 0268-8921 1435-604X |
DOI: | 10.1007/s10103-012-1227-8 |