Modeling the package of a LNA with a 3D-EM simulator

Modeling the package of a LNA with a 3D-EM simulator

In this work, the package influence on a feedback low‐noise amplifier has been studied.The electromagnetic simulator of ADS was used to obtain the QFN16 package model and the bonding model. The influence of the package and the pad on the supply node was negligible when it was studied separately. How...

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Veröffentlicht in:Microwave and optical technology letters 2013-07, Vol.55 (7), p.1435-1440
Hauptverfasser: García-Vázquez, Hugo, Khemchandani, Sunil L., Ramos-Valido, Dailos, Orbaiceta-Ezcurra, Krisnaya, del Pino, Javier
Format: Artikel
Sprache:eng
Schlagworte:
3D-EM
ADS
Bonding
Circuits
Computer simulation
Electrostatic discharges
feedback amplifier
Inductance
low-noise amplifier
Microwaves
On-line systems
package
Packages
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Zusammenfassung:In this work, the package influence on a feedback low‐noise amplifier has been studied.The electromagnetic simulator of ADS was used to obtain the QFN16 package model and the bonding model. The influence of the package and the pad on the supply node was negligible when it was studied separately. However, the circuit performance is reduced when the inductance introduced by the bonding of the supply node is combined with the parasitic capacities associated to the pad with electrostatic discharge protection. © 2013 Wiley Periodicals, Inc. Microwave Opt Technol Lett 55:1435–1440, 2013; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.27601
ISSN:0895-2477
1098-2760
DOI:10.1002/mop.27601