EOT Scaling of rm TiO 2 / rm Al 2 rm O 3 on Germanium pMOSFETs and Impact of Gate Metal Selection
rm TiO 2 / rm Al 2 rm O 3 / rm Ge gate stacks have promising characteristics for future germanium-channel high-performance MOSFETs. In this letter, rm TiO 2 / rm Al 2 rm O 3 bilayer high-k dielectrics with EOT 0.65 nm are demonstrated and used in Ge pMOSFETs for the first time, giving low subthresho...
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Veröffentlicht in: | IEEE electron device letters 2013-06, Vol.34 (6), p.732-734 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | rm TiO 2 / rm Al 2 rm O 3 / rm Ge gate stacks have promising characteristics for future germanium-channel high-performance MOSFETs. In this letter, rm TiO 2 / rm Al 2 rm O 3 bilayer high-k dielectrics with EOT 0.65 nm are demonstrated and used in Ge pMOSFETs for the first time, giving low subthreshold swing (71 mV/dec) and large on-state current (28 A/um). In addition, detailed investigations of these devices with two different gate metals-Al/W and Al/Pt-are performed for stable metal/ rm TiO 2 interfaces and EOT scaling. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2013.2259137 |