Flip-Chip Process Using Interlocking-Bump Joints

A new flip-chip process using interlocking-bump joints, formed by inserting Cu bumps into Sn bumps, was investigated. Severe plastic deformation of Sn bumps occurred during formation of the interlocking-bump-joint structure. Contact resistance of the interlocking-bump joints was remarkably improved,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on components and packaging technologies 2009-12, Vol.32 (4), p.909-914
Hauptverfasser:	Oh, Tae-Sung, Lee, Kwang-Yong, Won, Hye-Jin
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Bonding forces Chip shear force Contact Contact resistance Copper Cu bump Electronics packaging flip chip Glass Integrated circuit interconnections Integrated circuit technology interlocking bump Mechanical factors Packaging Plastic deformation Shear Sn bump Substrates Thermal stresses Tin
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!