Flip-Chip Process Using Interlocking-Bump Joints

A new flip-chip process using interlocking-bump joints, formed by inserting Cu bumps into Sn bumps, was investigated. Severe plastic deformation of Sn bumps occurred during formation of the interlocking-bump-joint structure. Contact resistance of the interlocking-bump joints was remarkably improved,...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2009-12, Vol.32 (4), p.909-914
Hauptverfasser:	Oh, Tae-Sung, Lee, Kwang-Yong, Won, Hye-Jin
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Bonding forces Chip shear force Contact Contact resistance Copper Cu bump Electronics packaging flip chip Glass Integrated circuit interconnections Integrated circuit technology interlocking bump Mechanical factors Packaging Plastic deformation Shear Sn bump Substrates Thermal stresses Tin
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Beschreibung
Zusammenfassung:	A new flip-chip process using interlocking-bump joints, formed by inserting Cu bumps into Sn bumps, was investigated. Severe plastic deformation of Sn bumps occurred during formation of the interlocking-bump-joint structure. Contact resistance of the interlocking-bump joints was remarkably improved, compared to that of planar-bump joints. The average contact resistances below 17 mOmega/ bump were obtained for the interlocking-bump joints processed with bonding forces larger than 7 N. The interface resistance between a Cu bump and a Sn bump in the interlocking-bump joints processed with a bonding force of 15 N was evaluated as 11.2 mOmega/bump . Chip shear force was greatly improved from 0.14 N of the planar-bump joints up to 3.9 N for the interlocking-bump joints.
ISSN:	1521-3331 1557-9972
DOI:	10.1109/TCAPT.2009.2015594