Effects of multi-layer graphene capping on Cu interconnects

The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2-7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material...

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Veröffentlicht in:	Nanotechnology 2013-03, Vol.24 (11), p.115707-115707
Hauptverfasser:	Kang, Chang Goo, Lim, Sung Kwan, Lee, Sangchul, Lee, Sang Kyung, Cho, Chunhum, Lee, Young Gon, Hwang, Hyeon Jun, Kim, Younghun, Choi, Ho Jun, Choe, Sun Hee, Ham, Moon-Ho, Lee, Byoung Hun
Format:	Artikel
Sprache:	eng
Schlagworte:	Breakdown Capping Condensed matter: electronic structure, electrical, magnetic, and optical properties CONNECTORS (ELECTRICAL) Copper Cross-disciplinary physics: materials science rheology CURRENT DENSITY Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures Electronic transport in multilayers, nanoscale materials and structures Exact sciences and technology Fullerenes and related materials diamonds, graphite Graphene Interconnections Materials science Multilayers Optimization Physics Specific materials WIRE
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Zusammenfassung:	The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2-7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimization, MLG capped Cu interconnects could become a promising technology for high density back end-of-line interconnects.
ISSN:	0957-4484 1361-6528
DOI:	10.1088/0957-4484/24/11/115707