Thermal Analysis of Susceptor with Rim Structure in MOCVD with the Chipped Infrared Heating System

A systematic study was performed on the susceptor with Rim structure. Rim structure at high temperature was simulated in the MOCVD reactor with the chipped Infrared heating system. Using the finite element method, the Rim structure groove height, depth and radius of the 8 inch substrate slot where the most symmetrical temperature distribution was obtained. Compared with the common graphite susceptor, the temperature distribution of the substrate was improved on the susceptor with Rim structure. By thermal analysis and contrast of Rim structures of the substrates with different radius substrates, the principle of Rim structure changing thermal uniformity was revealed. The results show that: the optimized 8 inch Rim structure of the substrates has a radius of 0.945 rS, a depth of 0.02rS, a height of hs; Rim structure has a good thermal stability in different heating power; the temperature uniformity of Rim structure is larger than that of common structure.