FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D

A simulation approach is presented which can be used to investigate electro-thermal behavior of power transistors in variety of operating conditions. The approach is discussed in detail and demonstrated using ANSYS simulator. The power transistor is considered as a distributed voltage controlled res...

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Veröffentlicht in:Microelectronics and reliability 2013-03, Vol.53 (3), p.356-362
Hauptverfasser: Košel, V., de Filippis, S., Chen, L., Decker, S., Irace, A.
Format: Artikel
Sprache:eng
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Zusammenfassung:A simulation approach is presented which can be used to investigate electro-thermal behavior of power transistors in variety of operating conditions. The approach is discussed in detail and demonstrated using ANSYS simulator. The power transistor is considered as a distributed voltage controlled resistor consisting of many in parallel connected cells. Because every cell has individual gate– and drain–source voltage, 3-D effects depending on geometric configuration and used materials can be observed. This is shown on a simple power transistor model for three principal electrical operating points: below TCP (temperature compensated point), at TCP and above TCP. Additionally, a mix-mode operating point is showed. The simulation results show 3-D effect of current density distribution as a function of the operating points. The results showed very good agreement with the prediction from the theory and already published results achieved by 3-D modeling approaches.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2012.09.002