Synthetic simulation of plasma formation, target erosion, and film deposition in a large magnetron sputtering apparatus

Examples of simulations of all relevant sputtering processes are described in this paper. Processes include plasma formation, target erosion, emission of sputtered atoms, and deposition of sputtered atoms for two types of magnetron sputtering apparatuses. One is axisymmetric and the other is three-dimensional. ► We simulate all sputtering processes. ► First we simulate plasma formation, next target erosion, and lastly film deposition. ► We apply the method to magnetron sputtering apparatuses. ► One is a large cylindrical apparatus with diameter 1200 mm. ► Another is a three-dimensional apparatus.