PTFE nanoemulsions as ultralow-k dielectric materials

PTFE nanoemulsions as ultralow-k dielectric materials

Modern integrated circuits require insulating materials with a dielectric constant as low as possible in order to obtain device speed improvements through lower RC delay. We have investigated the electrical and structural properties of PTFE thin films obtained from Algoflon®‐PTFE nanoemulsions, via...

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Veröffentlicht in:Macromolecular symposia. 2002-03, Vol.179 (1), p.347-358
Hauptverfasser: Machetta, Paola, Lazzarino, Marco, Kapeliouchko, Valeri, Poggio, Tiziana, Canil, Giorgio, Sanguineti, Aldo, Arcella, Vincenzo
Format: Artikel
Sprache:eng
Schlagworte:
Deposition
Dielectric strength
Nanocomposites
Nanoemulsions
Nanomaterials
Nanostructure
Polytetrafluoroethylenes
Spin coating
Thin films
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Zusammenfassung:Modern integrated circuits require insulating materials with a dielectric constant as low as possible in order to obtain device speed improvements through lower RC delay. We have investigated the electrical and structural properties of PTFE thin films obtained from Algoflon®‐PTFE nanoemulsions, via spin coating deposition, followed by sintering. Films as thin as 160 nm with dielectric strength better than 4 MV/cm have been obtained.
ISSN:1022-1360
1521-3900
DOI:10.1002/1521-3900(200203)179:1<347::AID-MASY347>3.0.CO;2-C