Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires

An innovative Ag-8Au-3Pd bonding wire containing a large amount of annealing twins has been produced. In contrast to the apparent grain growth in a conventional Ag-8Au-3Pd wire during aging at 600°C, the grain size of this annealing-twinned Ag alloy wire remains almost unchanged. The high thermal st...

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Veröffentlicht in:	Journal of electronic materials 2012-11, Vol.41 (11), p.3215-3222
Hauptverfasser:	Chuang, Tung-Han, Tsai, Chih-Hsin, Wang, Hsi-Ching, Chang, Che-Cheng, Chuang, Chien-Hsun, Lee, Jun-Der, Tsai, Hsing-Hua
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Annealing Applied sciences Bonding Characterization and Evaluation of Materials Chemistry and Materials Science Electronics and Microelectronics Elongation Exact sciences and technology Grain growth Grain size Grain structure Instrumentation Joining, thermal cutting: metallurgical aspects Materials Science Mechanical properties Metals. Metallurgy Optical and Electronic Materials Silver base alloys Solid State Physics Tensile strength Welding Wire
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Zusammenfassung:	An innovative Ag-8Au-3Pd bonding wire containing a large amount of annealing twins has been produced. In contrast to the apparent grain growth in a conventional Ag-8Au-3Pd wire during aging at 600°C, the grain size of this annealing-twinned Ag alloy wire remains almost unchanged. The high thermal stability of the grain structure leads to a smaller heat-affected zone near the free air ball of this twinned wire. The annealing twins in this material also result in the dual merits of increased tensile strength and elongation with aging time, which is beneficial for the reliability of wire-bonded packages.
ISSN:	0361-5235 1543-186X
DOI:	10.1007/s11664-012-2225-0