Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method fro...

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Veröffentlicht in:IEICE Transactions on Electronics 2012/05/01, Vol.E95.C(5), pp.898-903
Hauptverfasser: SHIN, Sang-Baie, IIJIMA, Ko-Ichiro, OKADA, Hiroshi, IWAYAMA, Sho, WAKAHARA, Akihiro
Format: Artikel
Sprache:eng
Schlagworte:
Adhesive bonding
Anisotropy
Arrays
Devices
Drivers
Electronics
Etching
flip-chip bonding
GaN LED arrays
micro-LED
opto-electronic integrated circuit
Silicon
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container_end_page 903
container_issue 5
container_start_page 898
container_title IEICE Transactions on Electronics
container_volume E95.C
creator SHIN, Sang-Baie
IIJIMA, Ko-Ichiro
OKADA, Hiroshi
IWAYAMA, Sho
WAKAHARA, Akihiro
description In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 × 128, each with a size of 15µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.
doi_str_mv 10.1587/transele.E95.C.898
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subjects Adhesive bonding
Anisotropy
Arrays
Devices
Drivers
Electronics
Etching
flip-chip bonding
GaN LED arrays
micro-LED
opto-electronic integrated circuit
Silicon
title Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices
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