Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method fro...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEICE Transactions on Electronics 2012/05/01, Vol.E95.C(5), pp.898-903
Hauptverfasser: SHIN, Sang-Baie, IIJIMA, Ko-Ichiro, OKADA, Hiroshi, IWAYAMA, Sho, WAKAHARA, Akihiro
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 × 128, each with a size of 15µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.
ISSN:0916-8524
1745-1353
DOI:10.1587/transele.E95.C.898