Enhanced surface integrity and dimensional accuracy by simultaneous micro-ED/EC milling

This paper presents the simultaneous micro-ED/EC milling that provides significantly improved surface integrity and dimensional accuracy when compared with micro-ED or micro-EC milling alone. The concurrent occurrence of electrochemical reaction and electrical discharge is attained by exploiting par...

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Veröffentlicht in:CIRP annals 2012, Vol.61 (1), p.191-194
Hauptverfasser: Nguyen, Minh Dang, Rahman, Mustafizur, Wong, Yoke San
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper presents the simultaneous micro-ED/EC milling that provides significantly improved surface integrity and dimensional accuracy when compared with micro-ED or micro-EC milling alone. The concurrent occurrence of electrochemical reaction and electrical discharge is attained by exploiting partially deionized water with appropriate process control. Machining speed is judiciously adjusted to promote electrochemical reaction for improving surface finish. Concurrently, short voltage pulses localize dissolution zone for greater precision while also remove micron-thick layer generated by discharge craters from the machined surface. Micro-shapes with enhanced surface finish and dimensional accuracy are produced to demonstrate the feasibility and capability of the aforementioned approach.
ISSN:0007-8506
DOI:10.1016/j.cirp.2012.03.011