The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems

The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:International journal of advancements in computing technology 2012-01, Vol.4 (1), p.155-162
Hauptverfasser: Guocan, Ren, Songliang, Wang, Hua, Shao
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 162
container_issue 1
container_start_page 155
container_title International journal of advancements in computing technology
container_volume 4
creator Guocan, Ren
Songliang, Wang
Hua, Shao
description The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.
doi_str_mv 10.4156/ijact.vol4.issue1.17
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1031292133</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1031292133</sourcerecordid><originalsourceid>FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</originalsourceid><addsrcrecordid>eNotkMtOwzAQRS0EEhX0D1h4ySbBYydxvEShPKRWLNqurTwm1FUSBzuhyt-TUmZzZ3F0r3QIeQAWRhAnT-aYl0P4Y5soNN6PCCHIK7LgXIhACSGv55-xOEiZULdk6f2RzackA4gXZL87IN0OYzVR29FVW2BVYUU32Fo30cy4cjQDfUFvvjpqOrq2p6C3J3R0azOaHUzvaW0d3djCNHPT5Ads_T25qfPG4_I_78j-dbXL3oP159tH9rwOSlBqCIDnHPMkZ6pWVcoZCCkjpWIWJ5gKFcsKi7wUwIoEoK4wFgVPQJZQxUymIMUdebz09s5-j-gH3RpfYtPkHdrRa2ACuOIgxIxGF7R01nuHte6daXM3zZA-i9R_IvVZpL6I1PPCLy0AaUg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1031292133</pqid></control><display><type>article</type><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><source>EZB-FREE-00999 freely available EZB journals</source><creator>Guocan, Ren ; Songliang, Wang ; Hua, Shao</creator><creatorcontrib>Guocan, Ren ; Songliang, Wang ; Hua, Shao</creatorcontrib><description>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</description><identifier>ISSN: 2005-8039</identifier><identifier>EISSN: 2233-9337</identifier><identifier>DOI: 10.4156/ijact.vol4.issue1.17</identifier><language>eng</language><subject>Battery ; Chips (memory devices) ; Circuit design ; Design engineering ; Embedded systems ; Mathematical models ; Mobile communication systems ; Power consumption ; Three dimensional</subject><ispartof>International journal of advancements in computing technology, 2012-01, Vol.4 (1), p.155-162</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Guocan, Ren</creatorcontrib><creatorcontrib>Songliang, Wang</creatorcontrib><creatorcontrib>Hua, Shao</creatorcontrib><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><title>International journal of advancements in computing technology</title><description>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</description><subject>Battery</subject><subject>Chips (memory devices)</subject><subject>Circuit design</subject><subject>Design engineering</subject><subject>Embedded systems</subject><subject>Mathematical models</subject><subject>Mobile communication systems</subject><subject>Power consumption</subject><subject>Three dimensional</subject><issn>2005-8039</issn><issn>2233-9337</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNotkMtOwzAQRS0EEhX0D1h4ySbBYydxvEShPKRWLNqurTwm1FUSBzuhyt-TUmZzZ3F0r3QIeQAWRhAnT-aYl0P4Y5soNN6PCCHIK7LgXIhACSGv55-xOEiZULdk6f2RzackA4gXZL87IN0OYzVR29FVW2BVYUU32Fo30cy4cjQDfUFvvjpqOrq2p6C3J3R0azOaHUzvaW0d3djCNHPT5Ads_T25qfPG4_I_78j-dbXL3oP159tH9rwOSlBqCIDnHPMkZ6pWVcoZCCkjpWIWJ5gKFcsKi7wUwIoEoK4wFgVPQJZQxUymIMUdebz09s5-j-gH3RpfYtPkHdrRa2ACuOIgxIxGF7R01nuHte6daXM3zZA-i9R_IvVZpL6I1PPCLy0AaUg</recordid><startdate>201201</startdate><enddate>201201</enddate><creator>Guocan, Ren</creator><creator>Songliang, Wang</creator><creator>Hua, Shao</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>201201</creationdate><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><author>Guocan, Ren ; Songliang, Wang ; Hua, Shao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Battery</topic><topic>Chips (memory devices)</topic><topic>Circuit design</topic><topic>Design engineering</topic><topic>Embedded systems</topic><topic>Mathematical models</topic><topic>Mobile communication systems</topic><topic>Power consumption</topic><topic>Three dimensional</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Guocan, Ren</creatorcontrib><creatorcontrib>Songliang, Wang</creatorcontrib><creatorcontrib>Hua, Shao</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>International journal of advancements in computing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Guocan, Ren</au><au>Songliang, Wang</au><au>Hua, Shao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</atitle><jtitle>International journal of advancements in computing technology</jtitle><date>2012-01</date><risdate>2012</risdate><volume>4</volume><issue>1</issue><spage>155</spage><epage>162</epage><pages>155-162</pages><issn>2005-8039</issn><eissn>2233-9337</eissn><abstract>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</abstract><doi>10.4156/ijact.vol4.issue1.17</doi><tpages>8</tpages></addata></record>
fulltext fulltext
identifier ISSN: 2005-8039
ispartof International journal of advancements in computing technology, 2012-01, Vol.4 (1), p.155-162
issn 2005-8039
2233-9337
language eng
recordid cdi_proquest_miscellaneous_1031292133
source EZB-FREE-00999 freely available EZB journals
subjects Battery
Chips (memory devices)
Circuit design
Design engineering
Embedded systems
Mathematical models
Mobile communication systems
Power consumption
Three dimensional
title The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T05%3A06%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Study%20on%20Embedded%20Memory%20Circuit%20Design%20in%20Low-power%20SoC%20Chips%20for%20Mobile%20Systems&rft.jtitle=International%20journal%20of%20advancements%20in%20computing%20technology&rft.au=Guocan,%20Ren&rft.date=2012-01&rft.volume=4&rft.issue=1&rft.spage=155&rft.epage=162&rft.pages=155-162&rft.issn=2005-8039&rft.eissn=2233-9337&rft_id=info:doi/10.4156/ijact.vol4.issue1.17&rft_dat=%3Cproquest_cross%3E1031292133%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1031292133&rft_id=info:pmid/&rfr_iscdi=true