The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems
The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discu...
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Veröffentlicht in: | International journal of advancements in computing technology 2012-01, Vol.4 (1), p.155-162 |
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container_title | International journal of advancements in computing technology |
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creator | Guocan, Ren Songliang, Wang Hua, Shao |
description | The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design. |
doi_str_mv | 10.4156/ijact.vol4.issue1.17 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1031292133</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1031292133</sourcerecordid><originalsourceid>FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</originalsourceid><addsrcrecordid>eNotkMtOwzAQRS0EEhX0D1h4ySbBYydxvEShPKRWLNqurTwm1FUSBzuhyt-TUmZzZ3F0r3QIeQAWRhAnT-aYl0P4Y5soNN6PCCHIK7LgXIhACSGv55-xOEiZULdk6f2RzackA4gXZL87IN0OYzVR29FVW2BVYUU32Fo30cy4cjQDfUFvvjpqOrq2p6C3J3R0azOaHUzvaW0d3djCNHPT5Ads_T25qfPG4_I_78j-dbXL3oP159tH9rwOSlBqCIDnHPMkZ6pWVcoZCCkjpWIWJ5gKFcsKi7wUwIoEoK4wFgVPQJZQxUymIMUdebz09s5-j-gH3RpfYtPkHdrRa2ACuOIgxIxGF7R01nuHte6daXM3zZA-i9R_IvVZpL6I1PPCLy0AaUg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1031292133</pqid></control><display><type>article</type><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><source>EZB-FREE-00999 freely available EZB journals</source><creator>Guocan, Ren ; Songliang, Wang ; Hua, Shao</creator><creatorcontrib>Guocan, Ren ; Songliang, Wang ; Hua, Shao</creatorcontrib><description>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</description><identifier>ISSN: 2005-8039</identifier><identifier>EISSN: 2233-9337</identifier><identifier>DOI: 10.4156/ijact.vol4.issue1.17</identifier><language>eng</language><subject>Battery ; Chips (memory devices) ; Circuit design ; Design engineering ; Embedded systems ; Mathematical models ; Mobile communication systems ; Power consumption ; Three dimensional</subject><ispartof>International journal of advancements in computing technology, 2012-01, Vol.4 (1), p.155-162</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Guocan, Ren</creatorcontrib><creatorcontrib>Songliang, Wang</creatorcontrib><creatorcontrib>Hua, Shao</creatorcontrib><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><title>International journal of advancements in computing technology</title><description>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</description><subject>Battery</subject><subject>Chips (memory devices)</subject><subject>Circuit design</subject><subject>Design engineering</subject><subject>Embedded systems</subject><subject>Mathematical models</subject><subject>Mobile communication systems</subject><subject>Power consumption</subject><subject>Three dimensional</subject><issn>2005-8039</issn><issn>2233-9337</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNotkMtOwzAQRS0EEhX0D1h4ySbBYydxvEShPKRWLNqurTwm1FUSBzuhyt-TUmZzZ3F0r3QIeQAWRhAnT-aYl0P4Y5soNN6PCCHIK7LgXIhACSGv55-xOEiZULdk6f2RzackA4gXZL87IN0OYzVR29FVW2BVYUU32Fo30cy4cjQDfUFvvjpqOrq2p6C3J3R0azOaHUzvaW0d3djCNHPT5Ads_T25qfPG4_I_78j-dbXL3oP159tH9rwOSlBqCIDnHPMkZ6pWVcoZCCkjpWIWJ5gKFcsKi7wUwIoEoK4wFgVPQJZQxUymIMUdebz09s5-j-gH3RpfYtPkHdrRa2ACuOIgxIxGF7R01nuHte6daXM3zZA-i9R_IvVZpL6I1PPCLy0AaUg</recordid><startdate>201201</startdate><enddate>201201</enddate><creator>Guocan, Ren</creator><creator>Songliang, Wang</creator><creator>Hua, Shao</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>201201</creationdate><title>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</title><author>Guocan, Ren ; Songliang, Wang ; Hua, Shao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c199t-12a2ea6a09f9d82013774995056e83957debac310b611fde53b2617c1d5078173</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Battery</topic><topic>Chips (memory devices)</topic><topic>Circuit design</topic><topic>Design engineering</topic><topic>Embedded systems</topic><topic>Mathematical models</topic><topic>Mobile communication systems</topic><topic>Power consumption</topic><topic>Three dimensional</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Guocan, Ren</creatorcontrib><creatorcontrib>Songliang, Wang</creatorcontrib><creatorcontrib>Hua, Shao</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>International journal of advancements in computing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Guocan, Ren</au><au>Songliang, Wang</au><au>Hua, Shao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems</atitle><jtitle>International journal of advancements in computing technology</jtitle><date>2012-01</date><risdate>2012</risdate><volume>4</volume><issue>1</issue><spage>155</spage><epage>162</epage><pages>155-162</pages><issn>2005-8039</issn><eissn>2233-9337</eissn><abstract>The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.</abstract><doi>10.4156/ijact.vol4.issue1.17</doi><tpages>8</tpages></addata></record> |
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source | EZB-FREE-00999 freely available EZB journals |
subjects | Battery Chips (memory devices) Circuit design Design engineering Embedded systems Mathematical models Mobile communication systems Power consumption Three dimensional |
title | The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T05%3A06%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20Study%20on%20Embedded%20Memory%20Circuit%20Design%20in%20Low-power%20SoC%20Chips%20for%20Mobile%20Systems&rft.jtitle=International%20journal%20of%20advancements%20in%20computing%20technology&rft.au=Guocan,%20Ren&rft.date=2012-01&rft.volume=4&rft.issue=1&rft.spage=155&rft.epage=162&rft.pages=155-162&rft.issn=2005-8039&rft.eissn=2233-9337&rft_id=info:doi/10.4156/ijact.vol4.issue1.17&rft_dat=%3Cproquest_cross%3E1031292133%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1031292133&rft_id=info:pmid/&rfr_iscdi=true |