The Study on Embedded Memory Circuit Design in Low-power SoC Chips for Mobile Systems

The most important characteristic is a battery of mobile communication system with high performance, low power consumption and small size. Small form factor, and realize the system chips (S degree C) and 3 D die-stacking (3 D-IC) method is to use multiple-chip instead of traditional solutions. Discusses the low voltage memory challenge created the circuit design and new memory solution and 3 D-IC mobile system chip (S degree C) application. We explore new processor-memory architecture interface and the memory of the mobile and 3 D-IC S degree C design.