Microstructure and ultrahigh strength of nanoscale Cu/Nb multilayers
The microstructure and mechanical properties of Cu/Nb multilayers were investigated by X-ray diffraction, transmission electron microscopy, scanning electron microscopy and nanoindentation. Ultrahigh strength of 3.27 GPa is achieved at the smallest layer thickness of 2.5 nm, which agrees well with t...
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Veröffentlicht in: | Thin solid films 2011-11, Vol.520 (2), p.818-823 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The microstructure and mechanical properties of Cu/Nb multilayers were investigated by X-ray diffraction, transmission electron microscopy, scanning electron microscopy and nanoindentation. Ultrahigh strength of 3.27
GPa is achieved at the smallest layer thickness of 2.5
nm, which agrees well with the theoretical prediction based on the deformation mechanism of crossing of dislocations across interfaces. After that, the strength decreases with the increasing layer thickness and the transition of the deformation mechanism to confined layer slip occurs at the layer thickness of 6.5
nm. Additionally, strength of the Cu/Nb multilayers increases with increasing loading strain rate because of enhanced strain hardening. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2010.12.251 |