Nano-size copper oxide encapsulated urea - formaldehyde resin film for arsenic (III) removal from aqueous solutions

The nano-size copper oxide with 40-50 nm dimensions was prepared through KNO sub(3): NaNO sub(3) eutectic melt and encapsulated in urea - formaldehyde (UF) resin during polymerisation. Particle size of CuO was determined by XRD and SEM techniques. CuO encapsulated in urea - formaldehyde resin in the form of film ( similar to 5 mm thickness) was used to remove As (III) content from aqueous solution. The process of As (III) removal was found to be efficient and cost effective.