Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

The interface microstructures as well as the rate kinetics of dissolution and IMC layer formation were investigated for couples formed between molten 63Sn-37Pb (wt%) and Pd sheet. The solder bath temperatures were 215-320 degree C, and the immersion times were 5, 15, 30, 60, 120 and 240 s. The exten...

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Veröffentlicht in:Platinum metals review 2011-04, Vol.55 (2), p.144-144
Hauptverfasser: Vianco, P T, Rejent, JA, Zender, G L, Hlava, P F
Format: Artikel
Sprache:eng
Schlagworte:
Couples
Dissolution
Interface reactions
Lead (metal)
Palladium
Platinum metals
Solders
Tin
Tin base alloys
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Zusammenfassung:The interface microstructures as well as the rate kinetics of dissolution and IMC layer formation were investigated for couples formed between molten 63Sn-37Pb (wt%) and Pd sheet. The solder bath temperatures were 215-320 degree C, and the immersion times were 5, 15, 30, 60, 120 and 240 s. The extents of Pd dissolution and IMC layer development were significantly greater for molten Sn-Pb than the Pb-free Sn-Ag-Cu (Part I, as above) at a given test temperature.
ISSN:0032-1400