Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper

Fatigue tests of ultrafine-grained copper specimens were conducted. The crack growth direction under constant stress depended on the magnitude of the stress amplitude. It occurred perpendicular to the loading axis at low stresses and was inclined at 45° to the loading axis at high stress. To clarify...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Scripta materialia 2012-03, Vol.66 (6), p.355-358
Hauptverfasser: Goto, M., Kamil, K., Han, S.Z., Euh, K., Yokoho, Y., Kim, S.S.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Fatigue tests of ultrafine-grained copper specimens were conducted. The crack growth direction under constant stress depended on the magnitude of the stress amplitude. It occurred perpendicular to the loading axis at low stresses and was inclined at 45° to the loading axis at high stress. To clarify the different growth mechanisms between the high- and low-stress amplitudes, two-step fatigue stress tests were conducted. The crack path formation under high- and low-stress amplitude is discussed from the viewpoint of the evolution of damaged areas around the crack.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2011.11.030