Self-etching adhesive on intact enamel, with and without pre-etching

OBJECTIVE: Bond strengths of composite resin to enamel using self‐etch adhesive (SEA) Clearfil SE bond system on intact enamel and enamel pre‐etched with phosphoric acid were compared. The objective was to determine if the pre‐etching would increase the bond strengths of the SEA systems to intact en...

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Veröffentlicht in:Microscopy research and technique 2012-05, Vol.75 (5), p.650-654
Hauptverfasser: Devarasa, G.M., Subba Reddy, V.V., Chaitra, N.L., Swarna, Y.M.
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Sprache:eng
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Zusammenfassung:OBJECTIVE: Bond strengths of composite resin to enamel using self‐etch adhesive (SEA) Clearfil SE bond system on intact enamel and enamel pre‐etched with phosphoric acid were compared. The objective was to determine if the pre‐etching would increase the bond strengths of the SEA systems to intact enamel and to evaluate the effect of pre‐etching on bond formation of self‐etch adhesives on intact enamel. MATERIALS AND METHOD: Labial surfaces of 40 caries free permanent upper central and lateral incisors were cleaned, sectioned of their roots. All specimens were mounted on acrylic block and divided randomly into four groups. In two groups the application of self‐etch adhesive, Clearfil SE bond was carried as per manufacturer's instructions, composite cylinders were built, whereas in the other two groups, 37% phosphoric acid etching was done before the application of self‐etching adhesives. Then the resin tags were analyzed using scanning electron microscope and shear bond strength was measured using Instron universal testing machine. RESULTS: When phosphoric acid was used, there was significant increase in the depth of penetration of resin tags and in the Shear Bond Strength of composite to enamel. CONCLUSION: The results indicate that out of both treatment groups, pre‐etching the intact enamel with 37% phosphoric acid resulted in formation of longer resin tags and higher depth of penetration of resin tags of the Clearfil SE bond, and attaining higher bond strength of the Clearfil SE bond to intact enamel. Microsc. Res. Tech., 2012. © 2011 Wiley Periodicals, Inc.
ISSN:1059-910X
1097-0029
DOI:10.1002/jemt.21106