Effect of H2 content on reliability of ultrathin in-situ steam generated (ISSG) SiO2
This letter demonstrates the effect of H/sub 2/ percentage during oxidation on the quality of the in-situ steam generated (ISSG) oxide. Our results indicate the reliability of ISSG oxide is considerably improved as the H/sub 2/ percentage increases, from the viewpoint of stress-induced leakage curre...
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Veröffentlicht in: | IEEE electron device letters 2000-09, Vol.21 (9), p.430-432 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This letter demonstrates the effect of H/sub 2/ percentage during oxidation on the quality of the in-situ steam generated (ISSG) oxide. Our results indicate the reliability of ISSG oxide is considerably improved as the H/sub 2/ percentage increases, from the viewpoint of stress-induced leakage current (SILC) and charge-to-breakdown (Q/sub BD/). Such enhanced reliability of the ISSG oxide may be explained by the reduction of defects in the SiO/sub 2/ network within the structural transition layer, such as Si dangling bonds, weak Si-Si and strained Si-O bonds, by highly reactive oxygen atoms which are hypothesized to be dissociated from the molecular oxygen due to the presence of hydrogen. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/55.863100 |