Effect of H2 content on reliability of ultrathin in-situ steam generated (ISSG) SiO2

This letter demonstrates the effect of H/sub 2/ percentage during oxidation on the quality of the in-situ steam generated (ISSG) oxide. Our results indicate the reliability of ISSG oxide is considerably improved as the H/sub 2/ percentage increases, from the viewpoint of stress-induced leakage curre...

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Veröffentlicht in:IEEE electron device letters 2000-09, Vol.21 (9), p.430-432
Hauptverfasser: Luo, T.Y., Laughery, M., Brown, G.A., Al-Shareef, H.N., Watt, V.H.C., Karamcheti, A., Jackson, M.D., Huff, H.R.
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Sprache:eng
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Zusammenfassung:This letter demonstrates the effect of H/sub 2/ percentage during oxidation on the quality of the in-situ steam generated (ISSG) oxide. Our results indicate the reliability of ISSG oxide is considerably improved as the H/sub 2/ percentage increases, from the viewpoint of stress-induced leakage current (SILC) and charge-to-breakdown (Q/sub BD/). Such enhanced reliability of the ISSG oxide may be explained by the reduction of defects in the SiO/sub 2/ network within the structural transition layer, such as Si dangling bonds, weak Si-Si and strained Si-O bonds, by highly reactive oxygen atoms which are hypothesized to be dissociated from the molecular oxygen due to the presence of hydrogen.
ISSN:0741-3106
1558-0563
DOI:10.1109/55.863100