AlGaN-GaN HEMTs on Si with power density performance of 1.9 W/mm at 10 GHz

AlGaN-GaN high electron mobility transistors (HEMTs) on silicon substrate are fabricated. The device with a gate length of 0.3-μm and a total gate periphery of 300 μm, exhibits a maximum drain current density of 925 mA/mm at V/sub GS/=0 V and V/sub DS/=5 V with an extrinsic transconductance (g/sub m...

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Veröffentlicht in:IEEE electron device letters 2004-07, Vol.25 (7), p.453-455
Hauptverfasser: Minko, A., Hoel, V., Morvan, E., Grimbert, B., Soltani, A., Delos, E., Ducatteau, D., Gaquiere, C., Theron, D., De Jaeger, J.C., Lahreche, H., Wedzikowski, L., Langer, R., Bove, P.
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Sprache:eng
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Zusammenfassung:AlGaN-GaN high electron mobility transistors (HEMTs) on silicon substrate are fabricated. The device with a gate length of 0.3-μm and a total gate periphery of 300 μm, exhibits a maximum drain current density of 925 mA/mm at V/sub GS/=0 V and V/sub DS/=5 V with an extrinsic transconductance (g/sub m/) of about 250 mS/mm. At 10 GHz, an output power density of 1.9 W/mm associated to a power-added efficiency of 18% and a linear gain of 16 dB are achieved at a drain bias of 30 V. To our knowledge, these power results represent the highest output power density ever reported at this frequency on GaN HEMT grown on silicon substrates.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2004.830272