Fabrication and Characterization of Thin-Barrier [Formula Omitted] HEMTs
The growth, fabrication, and performance of [Formula Omitted] high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current den...
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Veröffentlicht in: | IEEE electron device letters 2011-07, Vol.32 (7), p.889 |
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Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The growth, fabrication, and performance of [Formula Omitted] high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current density of 0.47 A/mm. Devices with a gate length of 90 nm achieve 78 GHz unity-current-gain frequency and up to 166 GHz maximum frequency of oscillation. The minimum noise figure at 10 GHz is 0.52 dB with an associated gain of 9.5 dB. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2011.2143384 |