Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn–0.7%Cu alloy from melt

The eutectic alloy Sn 99.3-x Cu 0.7 Ag x has been examined as one of the lead free solder alloys. Melting point, electrical resistivity, internal friction, elastic moduli, microhardness and the microstructure of the Sn 99.3 Cu 0.7 , Sn 95.8 Cu 0.7 Ag 3.5 and Sn 95.3 Cu 0.7 Ag 4 rapidly solidified lead free solder alloys have been investigated. The examined physical properties are improved by increasing silver contents in the studied lead free solder alloys. These improved properties indicate that these alloys are adequate for low temperature soldering applications.