Silica-Encapsulated Nanoparticle Films as Surface Modifications for MEMS

In an effort to improve the reliability of microelectromechanical systems (MEMS), silica thin films deposited by chemical vapor deposition were used to encapsulate gold nanoparticle coatings. These composite coatings were shown to provide extremely durable films that significantly reduce the adhesio...

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Veröffentlicht in:	Journal of microelectromechanical systems 2011-10, Vol.20 (5), p.1065-1067
Hauptverfasser:	Hurst, Kendall M., Ansari, Naveed, Roberts, Christopher B., Ashurst, W. Robert
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesives Cross-disciplinary physics: materials science rheology Durability Encapsulation Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Materials science Mechanical instruments, equipment and techniques Microelectromechanical systems Microelectromechanical systems (MEMS) Micromechanical devices Micromechanical devices and systems Nanocomposites Nanomaterials nanoparticles Nanoscale materials and structures: fabrication and characterization Nanostructure Physics Rough surfaces Silicon compounds Silicon dioxide stiction Surface roughness Surface topography Surface treatment Thin films
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Beschreibung
Zusammenfassung:	In an effort to improve the reliability of microelectromechanical systems (MEMS), silica thin films deposited by chemical vapor deposition were used to encapsulate gold nanoparticle coatings. These composite coatings were shown to provide extremely durable films that significantly reduce the adhesion energy of silicon-based microcantilever beams. The results discussed suggest that encapsulating nanoparticle films with a durable silica thin film may lead to improved MEMS reliability.
ISSN:	1057-7157 1941-0158
DOI:	10.1109/JMEMS.2011.2162494