Asymmetrically Recessed 50-nm Gate-Length Metamorphic High Electron-Mobility Transistor With Enhanced Gain Performance

We report the design, fabrication and characterization of ultrahigh gain metamorphic high electron-mobility transistors. In this letter, a high-yield 50-nm T-gate process was successfully developed and applied to epitaxial layers containing high indium mole fraction InGaAs channels grown on GaAs sub...

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Veröffentlicht in:IEEE electron device letters 2008-01, Vol.29 (1), p.4-7
Hauptverfasser: Dong Xu, Kong, W.M.T., Xiaoping Yang, Smith, P.M., Dugas, D., Chao, P.C., Cueva, G., Mohnkern, L., Seekell, P., Pleasant, L.Mt, Schmanski, B., Duh, K.H.G., Karimy, H., Immorlica, A., Komiak, J.J.
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Sprache:eng
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Zusammenfassung:We report the design, fabrication and characterization of ultrahigh gain metamorphic high electron-mobility transistors. In this letter, a high-yield 50-nm T-gate process was successfully developed and applied to epitaxial layers containing high indium mole fraction InGaAs channels grown on GaAs substrates. A unique gate recess process was adopted to significantly increase device gain by effectively suppressing output conductance and feedback capacitance. Coupled with extremely small 10 mum times 25 mum via holes on substrates thinned to 1 mil, we achieved a 13.5 dB maximum stable gain (MSG) at 110 GHz for a 30-mum gate-width device. To our knowledge, this is the highest gain performance reported for microwave high electron-mobility transistor devices of similar gate periphery at this frequency, and equivalent circuit modeling indicates that this device will operate at frequencies beyond 300 GHz.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2007.910787