Vertically Stacked SiGe Nanowire Array Channel CMOS Transistors

We demonstrate, for the first time, the fabrication of vertically stacked SiGe nanowire (NW) arrays with a fully CMOS compatible technique. Our method uses the phenomenon of Ge condensation onto Si and the faster oxidation rate of SiGe than Si to realize the vertical stacking of NWs. Gate-all-around...

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Veröffentlicht in:IEEE electron device letters 2007-03, Vol.28 (3), p.211-213
Hauptverfasser: Fang, W.W., Singh, N., Bera, L.K., Nguyen, H.S., Rustagi, S.C., Lo, G.Q., Balasubramanian, N., Kwong, D.-L.
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Sprache:eng
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Zusammenfassung:We demonstrate, for the first time, the fabrication of vertically stacked SiGe nanowire (NW) arrays with a fully CMOS compatible technique. Our method uses the phenomenon of Ge condensation onto Si and the faster oxidation rate of SiGe than Si to realize the vertical stacking of NWs. Gate-all-around nand p-FETs, fabricated using these stacked NW arrays as the channel (L g ges0.35 mum), exhibit excellent device performance with high I ON /I OFF ratio (~10 6 ), near ideal subthreshold slope (~62-75 mV/dec) and low drain induced barrier-lowering (~20 mV/V). The transconductance characteristics suggest quantum confinement of holes in the [Ge]-rich outer-surface of SiGe for p-FETs and confinement of electrons in the core Si with significantly less [Ge] for n-FETs. The presented device architecture can be a promising option to overcome the low drive current restriction of Si NW MOSFETs for a given planar estate
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2007.891268